Method and apparatus for creating RFID devices

ABSTRACT

A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

FIELD OF THE INVENTION

The present invention relates generally to manufacturing ofsemiconductor devices, and more particularly, to a method and apparatusfor creating RFID devices.

BACKGROUND OF THE INVENTION

Automatic identification of products has become commonplace. Forexample, the ubiquitous barcode label, placed on food, clothing, andother objects, is currently the most widespread automatic identificationtechnology that is used to provide merchants, retailers and shipperswith information associated with each object or item of merchandise.

Another technology used for automatic identification products is RadioFrequency Identification (RFID). RFID uses labels or “tags” that includeelectronic components that respond to radio frequency commands andsignals to provide identification of each tag wirelessly. Generally,RFID tags and labels comprise an integrated circuit (IC, or chip)attached to an antenna that responds to a reader using radio waves tostore and access the ID information in the chip. Specifically, RFID tagsand labels have a combination of antennas and analog and/or digitalelectronics, which often includes communications electronics, datamemory, and control logic.

One of the obstacles to more widespread adoption of RFID technology isthat the cost of RFID tags are still relatively high as lower costmanufacturing of RFID tags has not been achievable using currentproduction methods. Additionally, as the demand for RFID tags hasincreased, the pressure has increased for manufacturers to reduce thecost of the tags, as well as to reduce the size of the electronics asmuch as possible so as to: (1) increase the yield of the number of chips(dies) that may be produced from a semiconductor wafer, (2) reduce thepotential for damage, as the final device size is smaller, and (3)increase the amount of flexibility in deployment, as the reduced amountof space needed to provide the same functionality may be used to providemore capability.

However, as the chips become smaller, their interconnection with otherdevice components, e.g., antennas, becomes more difficult. Thus, tointerconnect the relatively small contact pads on the chips to theantennas in RFID inlets, intermediate structures variously referred toas “straps,” “interposers,” and “carriers” are sometimes used tofacilitate inlay manufacture. Interposers include conductive leads orpads that are electrically coupled to the contact pads of the chips forcoupling to the antennas. These leads provide a larger effectiveelectrical contact area between the chips and the antenna than do thecontact pads of the chip alone. Otherwise, an antenna and a chip wouldhave to be more precisely aligned with each other for direct placementof the chip on the antenna without the use of such strap. The largercontact area provided by the strap reduces the accuracy required forplacement of the chips during manufacture while still providingeffective electrical connection between the chip and the antenna.However, the accurate placement and mounting of the dies on straps andinterposers still provide serious obstacles for high-speed manufacturingof RFID tags and labels. Two challenging areas currently facingmanufacturers include:

1) Die Attachment: Accurately positioning dies (i.e., chips) forattachment to strap leads is difficult to achieve at the speeds neededto achieve high volume manufacturing.

2) Bonding: It is difficult to accurately bond, cure, and electricallyconnect the chips to strap leads at rates necessary to achieve highvolume manufacturing.

Several possible high-speed strap assembly strategies have beenproposed. The first approach, which uses “pick-and-place” machinestypically used in the manufacturing of circuit boards for picking upelectronic components and placing them on circuit boards, is accurate,but requires expensive machines that ultimately do not deliver asufficient throughput to justify the increased cost.

Another approach, referred to as a “self-assembly process,” is a methodin which multiple chips are first dispersed in a liquid slurry, shakenand assembled into a substrate containing chip receiving recesses. Somecurrent processes are described in U.S. Pat. No. 6,848,162, entitled“Method and Apparatus for High Volume Assembly of Radio FrequencyIdentification Tags,” issued to Arneson, et al. on Feb. 1, 2005; U.S.Pat. No. 6,566,744, entitled “Integrated Circuit Packages AssembledUtilizing Fluidic Self-Assembly,” issued to Gengel on May 20, 2003; and,U.S. Pat. No. 6,527,964, entitled “Methods and Apparatuses for ImprovedFlow in Performing Fluidic Self Assembly,” issued to Smith et al. onMar. 4, 2003.

Accordingly, there is a long-felt, but as yet unsatisfied need in theRFID device manufacturing field to be able to produce RFID devices inhigh volume, and to assemble them at much higher speed per unit costthan is possible using current manufacturing processes.

SUMMARY OF THE PREFERRED EMBODIMENTS

In accordance with the various exemplary embodiments thereof describedherein, the present invention provides a process for creatingsemiconductor devices, such as RFID assemblies, which begins with theprovision of an array of semiconductor dies mounted to a substrate andspaced apart at a first pitch, for example, as may be found in asingulated semiconductor wafer attached to a wafer sawing, or “blue”tape. The relative positions of the dies is first fixed by asolidifiable material, and the substrate and the solidifiable materialare then removed from the dies without changing their relative positionsin the array. The array of dies, or selectable subsets thereof, are thenelectrically coupled to respective ones of a plurality of straps,interposers, or antennas disposed in corresponding arrays.Advantageously, the spacing, or pitch, between the dies in the array maybe increased before or after the substrate is removed to match the pitchof the plurality of straps or antennas in the corresponding array.

In one exemplary embodiment of the present invention, the processincludes a method for transferring a plurality of semiconductor diesfrom a first substrate, wherein the dies are arranged on the firstsubstrate in a two-dimensional array having a first dimension. Themethod includes filling an interstitial space between the plurality ofdies in the array with a solidifiable substance. The substance is thensolidified such that the respective positions of each of the dies in thearray is fixed. The first substrate is then removed from the pluralityof dies before the solidifiable substance is removed from between thedies such that the plurality of dies remain arrayed at the firstdimension.

In another preferred embodiment of the present invention, the processincludes a method for creating an arrangement of integrated circuits.The method includes providing a wafer with an array of dies disposed ona substrate, the array having a first dimensional size. The substrate isthen stretched so that the array of dies reaches a second dimensionalsize. The size of the array is then fixed at the second dimensional sizewith a solid material, and the substrate is removed from the array. Thesolid material is then removed from the array, e.g., by a gasificationprocess, such that the array of dies remains at the second dimensionalsize after the removal of the solid material.

In another exemplary embodiment of the present invention, a process formaking an RFID assembly includes providing a wafer comprising an arrayof dies, the array of dies having a first dimensional size. A substrateis attached to the array of dies and the substrate is stretched suchthat the array of dies is increased from the first dimensional size to asecond dimensional size in which the dies are spaced apart by a selecteddistance or pitch. The array of dies is then fixed at the seconddimensional size by introducing a liquid into the spaces between thedies and solidifying the liquid, e.g., by freezing it. The substrate isremoved from the dies before converting the solid into a gas.

In a fourth preferred embodiment of the present invention, an RFIDdevice is made by the process of providing a plurality of dies arrangedin an array having a first dimension. Each die in the array includes atleast one contact and is set off from the adjacent dies by a first pitchas measured between the respective contacts of the die. An interstitialspace between the dies is then filled with a solidifiable substance andthe substance solidified such that the respective position of each ofthe dies in the array is fixed. The first substrate and the solidifiedsubstance are then removed from the plurality of dies such that theplurality of dies remain arrayed at the first dimension.

A plurality of electrical components is also provided. The electricalcomponents are arranged in an array on a second substrate and haveattachment locations disposed at the first pitch. The second substrateis registered with the array of dies such that respective attachmentlocations of the plurality of electrical components are matched with therespective at least one contact of the dies, and, respective ones of theplurality of electrical components are then electrically coupled tocorresponding ones of the dies in the array of dies.

Other features and advantages of the present invention will becomeapparent to those skilled in the art from the following detaileddescription. It is to be understood, however, that the detaileddescription of the various embodiments and specific examples, whileindicating preferred and other embodiments of the present invention, aregiven by way of illustration and not limitation. Many changes andmodifications within the scope of the present invention may be madewithout departing from the spirit thereof, and the invention includesall such modifications.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention may be more readily understood by referring to theaccompanying drawings in which:

FIG. 1 is a high-level flow diagram of a method for manufacturing asemiconductor device in accordance to a preferred embodiment of thepresent invention;

FIG. 2 is a detailed flow diagram of the method for manufacturing thesemiconductor device of FIG. 1 in accordance to a preferred embodimentof the present invention;

FIG. 3 is a diagram illustrating an expansion of a wafer having aplurality of dies mounted on a substrate pursuant to one preferredembodiment of the present invention;

FIG. 4 is a side view of the plurality of dies of FIG. 3 as displaced ona support platform and fixed in position by being frozen in a layer ofice after the expansion process;

FIG. 5 is a side view of the plurality of dies of FIG. 4 wherein thesubstrate is being removed in accordance with one preferred embodimentsof the present invention;

FIG. 6 is a side view of the plurality of dies of FIG. 4 wherein the icethat secured the plurality of dies in FIG. 4 and FIG. 5 has been removedby sublimation;

FIG. 7 is a phase diagram illustrating the state diagram for water;

FIG. 8 is a diagram illustrating the alignment of the plurality of diesusing a alignment grid configured in accordance with one preferredembodiment of the present invention;

FIG. 9 is a diagram illustrating the displacement of the alignedplurality of dies of FIG. 8 and the fixation of the chip locationsthrough the use of a fixation grid;

FIG. 10 is a plan view illustrating a selective transfer of a subset ofthe plurality of dies onto a corresponding set of straps in accordanceto one preferred embodiment of the present invention;

FIG. 11 is a side view illustrating the selective transfer of FIG. 10;

FIG. 12 is a side view of a bonding process wherein the subset of theplurality of dies of FIG. 10 is bonded to the set of straps inaccordance with one preferred embodiment of the present invention; and

FIG. 13 is a diagram illustrating the alignment of the plurality of diesusing combs configured in accordance with one preferred embodiment ofthe present invention.

Like numerals refer to like parts throughout the several views of thedrawings.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention provides a process that completely removes thedies or other devices from a diced wafer mounted on a wafer carrier withvirtually no residue of any adhesives used to attach the wafer to thecarrier. In addition, the present invention can change the spacingbetween the dies from an initial pitch, such as a spacing of the dies asinitially presented on the wafer, to a new pitch that supports directattachment of the dies to straps via a high-speed production processsuch as those using printing presses. The combination of the provisionof unattached dies and the accurate alignment thereof at a desiredspacing enables manufacturers to produce RFID devices at a substantiallyhigher rate than what is currently achieved, and may enable them toreach or exceed rates of one hundred thousand units per hour. This is alevel of magnitude higher than the volume achievable by currentmanufacturing methods using pick and place machines, viz., about tenthousand units per hour.

FIG. 1 is a high-level overview of one preferred embodiment of a process100 for the creation of a chip assembly of the present invention adaptedfor the manufacturing of RFID devices. In general, the process asillustrated involves four different stages, including an expansion stage102, during which the spacing and pitch between each die in anarrangement of dies on a stretchable substrate may be increased to matcha predetermined pitch for a web of straps; a freeze/peel/sublimationstage 104, during which the stretchable substrate may be removed fromthe arrangement of dies without leaving residual adhesive compounds; analignment stage 106, during which the arrangement of dies are furtheraligned; and a selective transfer stage 108, in which the array of diesor a subset thereof, respectively positioned in locations that match thepitch of a set of straps on a web, are transferred from the arrangementof dies. Finally, once the subset of dies are attached to the set ofstraps, one possible method for simultaneously bonding the dies to thestraps and for curing the adhesive used during that processes isdiscussed. As is further detailed below, other portions of the dieseparation and strap attachment process may be optional and the processdescribed herein may include portions that are not needed for aparticular application. Therefore, the following description should beread as illustrating exemplary embodiments of a novel die separation andstrap attachment process as practiced in one preferred embodiment of thepresent invention and should not be taken in a limiting sense.

FIG. 2 illustrates, in greater detail, specific steps in the method forpackaging a semiconductor device (such as an RFID device) as shown inFIG. 1, in accordance with one exemplary embodiment of the presentinvention. The description of the specific steps in FIG. 2 will refer toother figures as appropriate. As described above, the process forcreating RFID chip assemblies overcomes two major challenges—whether theprocess involves the assembly of a chip directly onto an antenna or,alternatively, the assembly of a chip onto a strap before the strap isattached to an antenna. The first hurdle is to attach the chipaccurately to specific locations on a structure such as a strap or anantenna. Secondly, the chip has to be bonded both mechanically andelectrically with the structure.

The present invention provides an efficient solution to the firstproblem, viz., how to attach chips accurately to a target location.Specifically, in the present invention, the chip attach solutionprovides a parallel processing approach in which a plurality of chipsare each attached to a corresponding structure simultaneously. However,an issue that arises in the implementation of the above solution is howthe dies, which typically are delivered in the form of a diced wafer,will be separated and placed at the appropriate locations. Specifically,after a wafer is fabricated (i.e., after the desired circuitry has beenformed on the wafer), it is “diced,” i.e., cut into small rectangularpieces with each piece (i.e., a die or chip) having the complete set ofcircuitry needed to provide the functions for which it was designed.Typically, the wafer is held on a carrier such as an adhesive tape, andthe wafer, now composed of the cut-up, or “singulated” dies, remain onthe carrier after the dicing. The dies are arranged very close to eachother on the adhesive tape, forming a dense array, or matrix, with verya small distance, or pitch, between them. However, the distance (pitch)between adjacent antennas (or adjacent straps on the strap web) istypically much larger, usually by an order of magnitude, than the pitchbetween the dies. Thus, one problem that needs to be solved for theabove-described die attach process is the provision of a method to matchthe pitch of the dies to the pitch of the straps (or antennas).

Referring to FIGS. 2 and 3, a wafer assembly 202 includes a plurality ofdies 306 arranged in a rectangular array and located on a substrate 302,such as a wafer tape, which is mounted on a “banjo,” or support frame304. The plurality of dies 306 are initially spaced apart at relativelysmall orthogonal (i.e., “X” and “Y”) pitches 308, 310, which are notlarge enough to allow processing of a single chip without disturbing theadjacent chips. Although conventional IC processing methods includestretching the wafer tape a small amount (viz., on the order of 10%) toallow the removal of individual chips without affecting others, thesetraditional solutions do not contemplate the stretching of the substrate302 to increase the pitch between the plurality of dies 306 by manyorders of magnitude so that the pitch of the dies will match the pitchof the structures to which they will ultimately be attached.

In one preferred embodiment of the present invention, the substrate 302is stretched one or more times so that the pitches 308, 310 areincreased to larger pitches 318, 320, and to arrive at a larger-sizedsecond array of dies 316. As noted in the series of steps shown in FIG.2, the process comprises a stretching or expansion step 204; a UVexposure step 206 that exposes and thereby de-tacks the adhesive used onthe substrate 302 to adhere to the dies to it; and a transfer step 208in which the plurality of dies 306 is transferred from the firstsubstrate 302 of FIG. 2 to another substrate.

In one preferred embodiment, the material used for the substrate 302 islinearly and uniformly stretchable in two orthogonal axes. For example,a polymer substrate film with adhesive bonding may be used. The film isattached to the back of the wafer (i.e., the side of the wafer oppositethe “active” side of the wafer that typically includes the contact padsof the dies). During the transfer, the stretched substrate, such assubstrate 302, may be scored or cut to enable the second substrate to bemore easily stretched. The process of stretching, de-tacking andtransferring may be continued indefinitely until a desired pitch (ororthogonal pitches) between the dies is (are) reached. In anotherpreferred embodiment, the stretching does not have to be uniform and maybe of a greater magnitude in one axis than another. For example, asdescribed further below, straps are typically elongated structures thatare more closely spaced in one direction so that it may be unnecessaryto stretch one of the orthogonal pitches of the plurality of dies 306 asmuch as the other so as to match the particular two-dimensional pitch ofthe straps.

After the plurality of dies 306 has been stretched to arrive at thelarger-sized second array of dies 316, the next step is thefreeze/peel/sublimation series of steps as represented by block 104 ofFIG. 2. In one preferred embodiment of the present invention, asillustrated by FIG. 4, in order to fix the orthogonal pitches 318, 320of the dies and to enable the relatively “clean” removal of an adhesivetape such as the substrate 302 from the dies of the array of dies 316,the substrate 302, with the array of dies thereon, is placed against aplate 402 (with the dies sandwiched in between), and a solidifiablesubstance 404, such as de-ionized, distilled water is introduced in theinterstitial spaces 320 between the dies 316 of the array. Thetemperature of the solidifiable substance 404 is then lowered to bebelow its freezing point such that it is changed in state to form asolid block, and such that it holds the array of dies 316 at the desiredpitches 318 and 320. Then, in step 212, the substrate 302 is peeled awayfrom the array of dies 316 to expose a plurality of contacts 406, withthe array of dies 316 still being held by the solidified substance 404,as shown in FIG. 5.

In one preferred embodiment of the present invention, once the substrate302 is removed, the solidifiable substance 404 may be removed so as toleave the dies 316 arranged on the plate 402 in their originaldimensional array. In another preferred embodiment of the presentinvention, the solidifiable substance may first be used as a “carrier”to move the dies from support 402 as the array of dies 316 may be moreeasily transported in this arrangement to another location for furtherprocessing. For example, the array of dies 316 may be moved from support402 to a tray (not shown) that will hold several such arrays of dies.Optionally, additional amounts of solidifiable substance 404 may then beintroduced to join the multiple arrays of dies together. In this manner,the multiple arrays of dies can be assembled to form even larger arraysof dies.

In one preferred embodiment of the present invention, the solidifiablesubstance 404 is removed without affecting the orientation of the arrayof dies 316 by sublimating the solidifiable substance 404, as shown inFIG. 6. The change in state in a case in which water is used as thesolidifiable substance 404 is shown in FIG. 7, which is a phase diagramillustrating the general principle of sublimation as used herein. Thesolidifiable substance 404 may be changed directly from a liquid state702 to a solid state 704, and finally to a gaseous state 706 by alteringthe temperature and/or pressure of the environment in which supportsurface 402 is located.

It should be noted that, in some cases, it might not be necessary tokeep the original position and pattern/orientation of the dies. Thus, inanother preferred embodiment of the present invention, in which thesolidifiable substance 404 is a liquid like water, the solidifiedsubstance, viz., ice, can simply be thawed and the array of dies 316 beallowed to dry under appropriate ambient conditions. Again, if theposition and pattern of the dies 316 of the array need to be maintained,the frozen liquid can be sublimated directly into vapor, so that thedies do not float, or otherwise move on the support surface 402 as thesolidified substance is removed. In one preferred embodiment of thepresent invention, the sublimation is achieved by known freeze-dryingtechniques, or by blowing mild, warm dry air onto the frozen surface. Inanother preferred embodiment, to keep the original position andorientation of the dies in the array of dies 316, a porous or liquidabsorbing surface may be used for the support 402. In this embodiment,there is no need to wait for the sublimation process to complete, as thesolidifiable substance 404, as it turns into its liquid state, willdrain into the porous or liquid absorbing surface without floating ormoving the dies in the array of dies 316. Further, a vacuum can also beapplied on the porous surface to accelerate the removal of liquid.

Although the process described above is described as using a liquid forthe solidifiable substance 404, other materials may be used to allowalternative dissipation methods. In other words, there are otherapproaches that may be used to remove the solidifiable substance 404from the die matrix. For example, in one preferred embodiment of thepresent invention, where organic materials and polymers are used as thesolidifiable substance 404, a plasma ashing process may be used toremove the organic materials and polymers from the matrix withoutdisturbing the original positions of the dies. In plasma ashing, amonatomic (oxygen or fluorine) reactive specie is generated using aplasma source. The reactive specie combines with the polymer to form agaseous product that may then removed with a vacuum pump.

In another preferred embodiment of the present invention, reactive ionetching (sometimes referred to as reactive sputter etching), which is aprocess that consists of bombarding the material to be etched withhighly energetic chemically reactive ions, is used to removesolidifiable substance 404. Such bombardment with energetic ionsdislodges atoms from the solidifiable substance 404, i.e., the materialto be removed, without adversely affecting the adjacent dies 316, ineffect, achieving removal by sputtering of the solidifiable substance404. Preferably, in addition to sputter-removal, the bombarding ionsused in reactive ion etching are chosen so that they will chemicallyreact with the material being bombarded to produce highly volatilereaction byproducts that can simply be pumped out of the system. Gasessuch as tetrafluoromethane (CF4) or sulfur hexafluoride (SF6) are twoexemplary gases that may be used in the reactive ion etching processwithout affecting the dies.

In yet another preferred embodiment of the present invention, thesolidifiable substance 404 can be removed by a dissolution process, inwhich the solidifiable substance 404 used is a dissipative material. Forexample, certain polymers can be dissolved in specific solvents.Similarly, chemical etching, in which acid or base etching liquids areused to remove materials, can also used to remove the solidifiablesubstance 404.

As those of skill in the art will appreciate, the present inventionprovides for the separation of dies from adhesive tape with minimaldamage during the adhesive tape removal and separation process, and alsoenables the dies 316 of to be freed of the adhesive tape relativelycleanly. In addition, the position and pattern of orientation of thedevices, as disposed on the original tape or another tape if the arrayhas been stretched or transferred multiple times, is preserved. Further,the removal of the substrate from the array of the dies 316 and theirre-positioning within the array is effected with no damage to the diesthemselves.

Although the tape removal process as described above is not intended toaffect the position of the dies in the array of dies 316, the alignmentof the dies after step 210 may still not be as accurate as desired. Instep 216 of FIG. 2, and referring to FIG. 8, the use of a precision diealignment grid 802 to further align the array of dies 316 on the supportsurface 402 is illustrated. In one preferred embodiment of the presentinvention, the alignment grid 802 is moved in a first direction parallelto the support surface 402, then in a second direction opposite to thefirst direction. Then, the alignment grid 802 is moved in a thirddirection that is orthogonal to the first and second directions, andfinally the alignment grid 802 moved in a fourth direction opposite tothe third direction. Once the dies in the array of dies 316 have beenalign as desired, it may be desirable to fix their position in the newalignment arrangement, as noted in step 218 of FIG. 2.

Referring to FIG. 9, a fixation grid 902 may be used to fix the positionand orientation of the dies in the array of dies 316. As seen in thefigure, the fixation grid 902 includes a plurality of apertures 904. Inone preferred embodiment of the present invention, each of the apertures904 includes an opening on one side of the fixation grid 902 that isslightly larger than the size of a respective die 316 in the array, andan opening on the opposite side of the grid that is substantially thesame size as a respective die of the array. Thus, the side of fixationgrid 902 with the larger openings for the plurality of apertures 904 isplaced over the array of dies 316, the grid is moved downward toward andinto contact with the support surface 402, and the tapered interiorsidewalls of the fixation grid 902 apertures 904 urge the dies 316 ofthe array into a more precise alignment that corresponds to theprecision of the apertures in the grid. In another preferred embodimentof the present invention, the openings on one side of the plurality ofapertures 904 may be smaller than the size of the dies in the array ofdies 316 to hold the dies in position against support 404 so that theymay be transported for further processing.

The alignment grid 902 can be fabricated of, e.g., semiconductormaterials, e.g., silicon, using well-known micromachining techniques, ina manner similar to those described in, e.g., U.S. Pat. No. 6,573,112 toKono et al.

FIGS. 10 and 11 illustrate a process for selectively attaching aplurality of straps 1002 mounted on a strap support substrate, or web1008, to a subset of dies 1006 in the array of dies 316 by overlayingthe straps 1002 on the dies. The dies are attached to a respective pairof straps with an adhesive 1004. In one preferred embodiment of thepresent invention, the adhesive 1004 is a In one preferred embodiment ofthe present invention, adhesive 1004 is an anisotropic conductiveadhesive (z-conductive adhesive). As shown in the top portion of FIG.10, the strap support structure 1008 is illustrated with a dottedoutline to represent that it is only a portion of a support structurethat may contain more straps that are not shown. In one preferredembodiment of the present invention, the size of the orthogonal pitches318, 320 between the dies in the array of dies 316 are matched torespective corresponding orthogonal pitches 1018, 1020 of the pluralityof straps 1002 in such a way that the size of the pitches 1018, 1020between the plurality of straps 1002 is a multiple of at least one ofthe pitches 318, 320 of the dies 316 of the array. Thus, as illustratedin FIG. 10, the substrate on which the array of dies 316 is placed isstretched such that the final pitch 320 between the dies matches thepitch 1020 of the straps, or, if it is impractical to stretch thesubstrate to reach a pitch that is equal to the pitch 1020 of thestraps, then to an integer multiple thereof. In FIG. 10 and FIG. 11, itis assumed that the pitch 318 between the dies has been made equal tothe spacing of the pitch 1018 between the straps. Thus, in one preferredembodiment of the present invention, the size of the pitch 318 is equalto the pitch 320, and in another preferred embodiment, may be an integermultiple thereof.

Those of skill in the art will appreciate that, although each die is“tacked”, or attached to a respective pair of straps by the adhesive1004, as described above, the adhesive is not cured and no electricalcoupling is necessarily formed between the contact pads on the dies andthe straps until a curing process occurs. FIG. 12 illustrates such acuring of the bond of the subset of dies 1006 that were attached to theplurality of straps 1002 with adhesives 1004, as illustrated in FIG. 10and FIG. 11 to form a strap assembly, in accordance with one preferredembodiment of the present invention.

As illustrated in FIG. 12 and described in more detail in, e.g., U.S.patent application Ser. No. 10/872,235, filed Jun. 18, 2004, pair ofplatens 1210 and 1208 forces together the plurality of straps 1002, theadhesives 1004, and the subset of dies 1006. The provision of nearinfrared (NIR) energy from a NIR emitter chamber 1208 causes theadhesives 1004 to set and an electrical connection to be made betweenthe contacts on each of the dies to a respective contact on each of thestraps. A resilient layer 1204 enables the pressure to be applied to thestrap assembly uniformly. In one preferred embodiment of the presentinvention, the platen 1206 and resilient layer 1204 are made of quartzand silicon, respectively, as quartz and silicon are nearly transparentto NIR.

FIG. 13 illustrates a second approach for increasing the pitch betweenthe array of dies 316 from their original orthogonal wafer pitches 308,310 to another pitches 1318, 1320, respectively, in accordance withanother preferred embodiment of the present invention. In this approach,a comb 1302 is moved parallel to the support substrate 402 and along afirst axis, herein referred to as the X-axis, to increase the pitchbetween two columns of dies from the small pitch 308 to the second,larger pitch 1318. In addition, a second comb 1304 is moved along asecond axis, referred to herein as the Y-axis, to increase the pitchbetween two rows of dies from the small pitch 310 to the second pitch1320.

In one preferred embodiment of the present invention, each of combs 1302and 1304 includes a plurality of teeth 1322 and 1324, respectively. Thespacing between each tooth in the combs may be matched to the size ofthe dies in the array of dies 316 to help retain the dies as they aremoved. Alternatively, the spacing between each tooth in the combs may belarger to enable the comb 1302 to be used with a variety of spacingsbetween the dies. For example, the spacing between each tooth in thecomb 1324 is large enough to account for the expansion of the spacingbetween the dies from the movement of the comb 1302. In addition, thespacing between each pair of teeth may be large enough to accommodatemore than one die. In another preferred embodiment of the presentinvention, a single comb such as the comb 1302 may be used to increasethe pitch between dies in both axes, and the comb 1302 may either berotated orthogonally as needed to achieve the proper orientation, or inan alternative embodiment in which the comb is not rotated, the teeththemselves may be used to move the dies. In yet another preferredembodiment of the present invention, blades that do not include teethare used to increase the pitch between dies.

It should be obvious to those of ordinary skill in the art that althoughthe description contained herein with regard to the change in pitchesbetween the dies in the plurality of dies 306 has been directed to anoperation to increase the pitches in one or more dimensions, thetechniques may also be equally be applicable to operations to decreasethe pitches between the dies in one or more dimensions. Further, becausethe combs 1302, 1304 may be used to change the pitch between the dies,as described above, the stretching operation as described in theexpansion stage 102 is eliminated. In another preferred embodiment, thecombs 1302, 1304 may be used perform an alignment of the dies and notspecifically to change the spacing between the dies.

As described herein, the die detachment and separation process of thepresent invention provides manufacturers the ability to perform batchprocessing of a large number of dies simultaneously, providing volumesthat surpasses those achievable by such inherently slower approaches asthe one-by-one pick-and-place process. The present invention providesthese benefits through such approaches as direct chip separation, whereremoval of the dies from a wafer tape will not cause the orientation orthe sides of the dies/chips to be perturbed; and selective transfer, aprocess where the chips are separated, or spaced apart, at distancewhere a multiple thereof will match the distance in pitch of the straps.Advantages of the direct chip separation technique over other assemblymethods include the ability for manufacturers to perform massivecomplete wafer-by-wafer or segment-by-segment transfers of dies fromwafers directly to another surface such as a web without significantchange in pattern or orientation of the dies. In addition, although thestretching step used to implement the spacing needed for selectivetransfer is likely to be a low precision operation (depending on theamount of separation needed), a separate alignment step can be used toaddress any inaccuracies in positioning introduced during the stretchingstep.

The embodiments described above are exemplary embodiments of the presentinvention. Those skilled in the art may now make numerous uses of, anddepartures from, the above-described embodiments without departing fromthe inventive concepts disclosed herein. Accordingly, the presentinvention is to be defined solely by the scope of the following claims.

1. A method for transferring a plurality of semiconductor dies from afirst substrate, the dies being arranged on the first substrate in anarray having a first dimension, the method comprising: filling aninterstitial space between the plurality of dies in the array with asolidifiable substance; solidifying the substance such that a respectiveposition of each of the dies in the array is fixed; removing the firstsubstrate from the plurality of dies; and, removing the solidifiedsubstance from between the plurality of dies such that the plurality ofdies remain arrayed at the first dimension.
 2. The method of claim 1,further comprising: transferring the plurality of dies to a supportsurface after removing the first substrate from the plurality of diesbut before removing the solidified substance; and placing a secondplurality of dies arranged in a second array adjacent to the pluralityof dies such that a spacing of at least two of the dies in the secondarray of dies is matched to a corresponding number of dies in the firstarray of dies.
 3. The method of claim 2, wherein the second array has asecond dimension equal to the first dimension of the first array.
 4. Themethod of claim 1, further comprising expanding the first substrate suchthat an initial dimension of the array is increased to the firstdimension.
 5. The method of claim 1, wherein the first substratecomprises an elastic membrane.
 6. The method of claim 1, wherein thesubstance comprises a liquid.
 7. The method of claim 6, wherein theliquid comprises water.
 8. The method of claim 1, wherein the substancecomprises an organic material.
 9. The method of claim 6, whereinsolidifying the substance comprises changing a state of the substancefrom a liquid state to a solid state.
 10. The method of claim 1, whereinsolidifying the substance comprises freezing the substance.
 11. Themethod of claim 1, wherein removing the solidified substance compriseschanging the state of the substance from a solid to a non-solid.
 12. Themethod of claim 1, wherein removing the solidified substance comprisessublimating the solidified substance.
 13. The method of claim 1, whereinremoving the solidified substance comprises exposing the solidifiedsubstance to a reactive specie.
 14. The method of claim 1, whereinremoving the solidified substance comprises plasma ashing the solidifiedsubstance.
 15. The method of claim 1, wherein removing the solidifiedsubstance comprises reactive ion etching the solidified substance. 16.The method of claim 1, wherein removing the solidified substancecomprises exposing the solidified substance with a material that ischemically reactive with the solidified substance.
 17. The method ofclaim 16, wherein the chemically reactive material is a gas.
 18. Themethod of claim 16, wherein the chemically reactive material is aliquid.
 19. The method of claim 1, wherein removing the solidifiedsubstance comprises mechanically removing the solidified substance. 20.The method of claim 1, wherein removing the solidified substancecomprises bombarding the solidified substance with ions.
 21. The methodof claim 1, further comprising: placing at least one electricalcomponent of an arrangement of electrical components in registrationwith at least one corresponding die in the array of dies, wherein thearrangement of electrical components is disposed on a second substrate;and, electrically coupling the at least one corresponding electricalcomponent in the arrangement of electrical components to the at leastone corresponding die in the array of dies.
 22. The method of claim 21,wherein the at least one electrical component is selected from a groupconsisting of straps, interposers and antennas.
 23. The method of claim21, further comprising attaching an elongated substrate to the at leastone die.
 24. The method of claim 23, further comprising connecting aplurality of the elongated substrates end to end in a lengthwise fashionto form a web.
 25. The method of claim 1, wherein each die has a size,further comprising: providing a grid containing an array of apertures;and, before filling the interstitial space between the plurality of diesin the array with the solidifiable substance, placing the grid over thedies such that the grid is disposed parallel to the array of dies andeach of the dies is held in position by a respective one of theapertures in the array of apertures.
 26. The method of claim 1, whereineach die in the array of dies includes at least one contact and each diein the array of dies is set off from another die by a first pitch asmeasured between the respective contacts of each die, and furthercomprising: providing a plurality of electrical components arranged inan array on a second substrate, the plurality of electrical componentshaving attachment locations disposed at the first pitch; registering thesecond substrate with the array of dies such that respective attachmentlocations of the plurality of electrical components are matched with therespective at least one contact of the dies; and electrically couplingrespective ones of the plurality of electrical components tocorresponding ones of the dies in the array of dies.
 27. The method ofclaim 26, wherein the electrical components are selected from a groupconsisting of straps, interposers and antennas.
 28. An electrical devicemanufactured in accordance with the method of claim 26.